New Tech Europe | Jan 2017 | Digital Edition

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ASUS relies on Infineon REAL3™ image sensor chip to bring
Augmented Reality into compact smartphones
The REAL3™image sensor chip from Infineon Technologies
AG (FSE: IFX / OTCQX: IFNNY) plays a key role in the newest
innovative Augmented Reality (AR) smartphone by ASUS.
The mobile device was launched yesterday at International
CES ® 2017 (International Consumer Electronics Show) in
Las Vegas. The ASUS Zenfone AR is the world’s thinnest
smartphone that offers a 3D Time-of-Flight (ToF) camera for
3-dimensional perception of its surroundings in real-time.
AR enriches the perception of the real environment with
written text as well as virtual objects that are embedded in
correct scale and realistic perspective. For instance, these
and power efficiency.”
The latest in a line of proven, high performance mobile
processors, the Snapdragon 835 processor’s architecture
allows for higher power efficiency, increased performance,
longer battery life, and slimmer device size when compared to
previous generations of processors, and ideal for manufacturers
racing to meet demand for products that can deliver the next-
generation of connectivity-rich user experiences. Snapdragon
835 combines Qualcomm® Kryo™ 280 CPU with Qualcomm
Technologies’ many additional low power, high-performance
processing technologies to support great battery life for user
experiences such as AR and VR, listening to high fidelity audio,
watching HD video, playing games, and using the camera/
camcorder. Snapdragon 835 is an Ultra HD Premium mobile
processor and supports full 4K/60fps, 10-bit HDR10/HEVC
video decode, HDR graphics rendering and display directly to
wide color gamut 10-bit 4K displays.
“As consumers look for more and more out of their mobile
devices, we are seeing a shift taking place towards a new
era of mobile computing,” said Ralph Osterhout, founder and
chief executive officer, ODG. “This is so much bigger than
just a device, it’s about a whole new computing medium that
will transform how we interact and discover information and
engage with people and objects in the world around us. The
Snapdragon 835 processor’s superior performance and power
efficiency allows us to accelerate along the path we’ve been
striving towards for so long – in bringing a self-contained,
lightweight and powerful headworn computing device with
stunning visual experiences to the consumer. It is an honor
virtual objects may be animated animals or domino bricks
in gaming applications. Projecting virtual furniture into a
real home environment before ordering items at an online
store is another application example. Besides consumer
applications, AR can also be used in industrial manufacturing
for maintenance of complex equipment and construction.
Both, the Infineon REAL3 image sensor and the ASUS Zenfone
AR smartphone are on display at the Infineon CES booth
MP25265 in South Hall 2 of the Las Vegas Convention Center.
Time-of-Flight provides accurate and robust depth data
The REAL3 image sensor chip is the key component of the
to work so closely with the brilliant minds at Qualcomm
Technologies and to be the first to announce that we are
integrating this latest technology into devices.”
R-8 brings the power of mobile virtual computing to
consumers. With a greater than 40˚ FOV and HD resolution,
innovative consumers can access the familiarity of movies,
sports, gaming, navigation and education experiences but on
smartglasses that are lighter, smaller and sleeker than any
other device in ODG’s portfolio. R-8 offers the same private
screen that floats in your view, wherever you are and however
you are moving, with the added dimension of AR, VR and
Mixed Reality overlays for a richer computing experience.
R-9 is based on ODG’s award-winning 50° FOV and 1080p
Project Horizon platform, and is a winner in three CES
Innovation Award categories. Targeted to a variety of
WFOV experiences from light enterprise to prosumer mobile
media consumption, it is also a development platform for
sophisticated mobile AR/VR and smartglasses applications.
Both devices benefit from advanced features within Qualcomm
Technologies’ Snapdragon VR SDK, such as hardware
accelerated, visual inertial odometry based 6DOF motion
tracking. For more details, see ODG’s release here: http://
ODG_Introduces_R-8_and_R-9_Smartglasses.pdf
The Snapdragon 835 is in production now and is expected
to ship in commercial devices in the first half of 2017. For
more information please visit:
products/snapdragon/processors/835.
New-Tech Magazine Europe l 11