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NXP Presents the World’s First One-Chip Solution for All

Global In-Car Infotainment and Broadcast Standards

Software-defined, multi-standard device for global digital and

analog broadcast standards AM/FM, DAB(+), DRM(+) and HD

Ultra-compact single chip integrating six ICs into one: radio and

audio as one combined high-performance system solution

Seamless integration with NXP’s latest automotive multimedia

processor families and next-generation NXP smart Class D

Amplifier

LAS VEGAS, Jan. 04, 2017 (GLOBE NEWSWIRE) — At CES® 2017,

NXP Semiconductors N.V. (NASDAQ:NXPI), the global leader in

automotive and in-car infotainment semiconductor solutions,

announced the SAF4000 – the world’s first fully integrated

software defined radio solution capable of covering all global

broadcast audio standards, including AM/FM, DAB+, DRM(+)

and HD. The new IC represents a breakthrough in simplifying

the development of high-performance infotainment platforms as

it replaces today’s multi-chip solutions with a single ultra-compact

RFCMOS device.

The SAF4000 is software-defined, thus simplifying the

ON Semiconductor License CEVA Imaging and Vision

Platform for Automotive ADAS

CEVA, Inc. (NASDAQ: CEVA), the

leading licensor of signal processing IP

for smarter, connected devices, today

announced that ON Semiconductor

has licensed CEVA’s imaging and vision

platform for its automotive advanced

driver assistance (ADAS) product lines.

ON Semiconductor will leverage CEVA’s

industry-leading vision processing IP to

enhance their future products with new

image processing capabilities and to

incorporate embedded intelligence and

machine learning into its ADAS roadmap.

The role of intelligent vision processors in automotive safety

systems continues to evolve at a rapid pace, with market

research firm Strategy Analytics predicting that the emergence

of new camera applications and imaging concepts will help drive

automotive camera demand to reach almost 200 million units in

2023. With advanced safety features set to be adopted across all

price points of the automotive market, there is a strong demand

for more cost-effective, flexible and scalable vision architectures.

Efficient vision processing addresses computationally-intensive

imaging and machine learning use cases, including better low

light processing and the ability to run more powerful deep

neural networks that can provide the accuracy and performance

of tomorrow’s active safety systems. These dynamics have led

ON Semiconductor to select CEVA’s imaging and vision platform

to augment their ADAS product offerings and address this

burgeoning market opportunity.

CEVA’s imaging and vision platforms

efficiently addresses the intensive

processing requirements of the most

sophisticated computer vision and

deep learning applications such as

video analytics, augmented reality and

advanced driver assistance systems

(ADAS). These highly-efficient vision

DSPs and accelerators dramatically

reduce the power consumption of

the overall system, while providing

complete flexibility. CEVA’s XM DSPs include a hybrid architecture

composed of scalar and vector DSP processors coupled with a

comprehensive Application Development Kit (ADK) to streamline

software deployment. The CEVA ADK includes: CEVA-Link for

seamless software level integration with the host processor; a

range of widely used and optimized software algorithms; the CEVA

Deep Neural Network (CDNN2) real-time neural network software

framework which streamlines machine learning deployment at

a fraction of the power consumption of the leading GPU-based

systems, and; state-of-the-art development and debugging tools.

For developers of Advanced Driver Assistance Systems (ADAS),

an ISO 26262 compliant safety design package is available for the

CEVA vision processors that enables customers to achieve their

desired level of safety certification. For more information, visit

http://www.ceva-dsp.com/CEVA-XM-Family.

14 l New-Tech Magazine Europe