LatestNews
NXP Presents the World’s First One-Chip Solution for All
Global In-Car Infotainment and Broadcast Standards
Software-defined, multi-standard device for global digital and
analog broadcast standards AM/FM, DAB(+), DRM(+) and HD
Ultra-compact single chip integrating six ICs into one: radio and
audio as one combined high-performance system solution
Seamless integration with NXP’s latest automotive multimedia
processor families and next-generation NXP smart Class D
Amplifier
LAS VEGAS, Jan. 04, 2017 (GLOBE NEWSWIRE) — At CES® 2017,
NXP Semiconductors N.V. (NASDAQ:NXPI), the global leader in
automotive and in-car infotainment semiconductor solutions,
announced the SAF4000 – the world’s first fully integrated
software defined radio solution capable of covering all global
broadcast audio standards, including AM/FM, DAB+, DRM(+)
and HD. The new IC represents a breakthrough in simplifying
the development of high-performance infotainment platforms as
it replaces today’s multi-chip solutions with a single ultra-compact
RFCMOS device.
The SAF4000 is software-defined, thus simplifying the
ON Semiconductor License CEVA Imaging and Vision
Platform for Automotive ADAS
CEVA, Inc. (NASDAQ: CEVA), the
leading licensor of signal processing IP
for smarter, connected devices, today
announced that ON Semiconductor
has licensed CEVA’s imaging and vision
platform for its automotive advanced
driver assistance (ADAS) product lines.
ON Semiconductor will leverage CEVA’s
industry-leading vision processing IP to
enhance their future products with new
image processing capabilities and to
incorporate embedded intelligence and
machine learning into its ADAS roadmap.
The role of intelligent vision processors in automotive safety
systems continues to evolve at a rapid pace, with market
research firm Strategy Analytics predicting that the emergence
of new camera applications and imaging concepts will help drive
automotive camera demand to reach almost 200 million units in
2023. With advanced safety features set to be adopted across all
price points of the automotive market, there is a strong demand
for more cost-effective, flexible and scalable vision architectures.
Efficient vision processing addresses computationally-intensive
imaging and machine learning use cases, including better low
light processing and the ability to run more powerful deep
neural networks that can provide the accuracy and performance
of tomorrow’s active safety systems. These dynamics have led
ON Semiconductor to select CEVA’s imaging and vision platform
to augment their ADAS product offerings and address this
burgeoning market opportunity.
CEVA’s imaging and vision platforms
efficiently addresses the intensive
processing requirements of the most
sophisticated computer vision and
deep learning applications such as
video analytics, augmented reality and
advanced driver assistance systems
(ADAS). These highly-efficient vision
DSPs and accelerators dramatically
reduce the power consumption of
the overall system, while providing
complete flexibility. CEVA’s XM DSPs include a hybrid architecture
composed of scalar and vector DSP processors coupled with a
comprehensive Application Development Kit (ADK) to streamline
software deployment. The CEVA ADK includes: CEVA-Link for
seamless software level integration with the host processor; a
range of widely used and optimized software algorithms; the CEVA
Deep Neural Network (CDNN2) real-time neural network software
framework which streamlines machine learning deployment at
a fraction of the power consumption of the leading GPU-based
systems, and; state-of-the-art development and debugging tools.
For developers of Advanced Driver Assistance Systems (ADAS),
an ISO 26262 compliant safety design package is available for the
CEVA vision processors that enables customers to achieve their
desired level of safety certification. For more information, visit
http://www.ceva-dsp.com/CEVA-XM-Family.14 l New-Tech Magazine Europe




