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Dassault Systèmes Boosts Experience-Thinking Innovation on the
3DEXPERIENCE Platform with the HTC Vive Business Edition
Dassault Systèmes (Euronext Paris:
#13065
,DSY.PA),the3DEXPERIENCE
Company, world leader in 3D design
software, 3D Digital Mock Up and
Product Lifecycle Management
(PLM) solutions today announced
that 3DEXPERIENCE platform users
can now view, explore and validate
product designs in immersive virtual
reality at any stage of the product
development process with support
from the HTC Vive™ Business Edition
virtual reality system. This opens new ways to create and refine
engaging customer experiences faster.
world’s smallest 3D camera
module for smartphones. It
is based on the Time-of-Flight (ToF)
principle and measures the time the
infrared signal takes to travel from
the camera to the object and back
again. The elapsed time is called
“time of flight”. Compared to other
3D sensing principles, ToF offers
advantages in performance, size
and power consumption of battery-
operated mobile devices.
ASUS is among the world’s largest
smartphone manufacturers. Its newest smartphone is less
than 9 mm in height. It demonstrates that the REAL3 camera
module which has a total height of only 5.9 mm is fully
compatible with even the smallest smartphone form factors.
Another winning characteristic of the 3D camera module is its
low power consumption: it requires less than 150 mW during
operation which can be easily delivered by the Zenfone AR’s
state-of-the-art 3,300 mAh battery. The ASUS Zenfone AR
smartphone is expected to hit the stores later this year.
“3D scanning with semiconductors from Infineon helps
to interconnect the real and virtual worlds,” said Martin
Gotschlich, Director, 3D Imaging at Infineon Technologies.
“Mobile devices with an integrated 3D image sensor
3DEXPERIENCE
platform
users
including
industrial
designers,
mechanical engineers, marketers,
project managers, manufacturing
planners and other decision makers in
any industry, can plug and play an HTC
Vive Business Edition head-mounted
display and work at their desktop with
natural navigation in a stereoscopic
virtual reality environment. This new
way to access, view and explore a native
virtual model on the 3DEXPERIENCE
platform during product development delivers an enhanced
spatial impression for a deeper understanding of an
have spatial awareness of their
surroundings and the capability
for augmented reality applications
with an impressive realistic quality.
They pave the way for numerous
applications and innovations that
were not previously possible.”
Coming strong: Augmented Reality
in smartphones
Today, AR is in an early introduction
phase representing a niche market.
It will be up to smartphone users to
identify applications that they desire
in the course of their daily life. This may realize a huge business
potential: just the premium segment of smartphones is rated
to be more than 400 million devices sold each year. Currently,
already four of the top five camera module makers for mobile
devices and smartphones are actively working on camera
module designs using Infineon’s REAL3 image sensor. Two
of them are already delivering devices in volume quantities.
These module designs are inspired by the leading ToF camera
reference designs by the company pmdtechnologies.
More information about the 3D image sensor family of
Infineon and about the company’s demonstrations at CES
2017 is available at
www.infineon.com/real3and at www.
infineon.com/CES12 l New-Tech Magazine Europe