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new products
aerial vehicles (UAVs). The ADXL356 and ADXL357
MEMS accelerometers are the latest examples of high
performance sensor technology from Analog Devices
that provides high-quality data for Internet of Things
(IoT) applications and enables intelligent sensing from
the edge of the network.
The analog output ADXL356 and the digital output
ADXL357 three-axis accelerometers provide selectable
measurement ranges of ±10 g, ±20 g and ±40 g for
greater flexibility. The ADXL356 and ADXL357 also offer
industry leading noise density of 80 µg/root Hz, with
guaranteed maximum 0 g offset drift over temperature of
0.75 mg/C, enabling precision applications with minimal
calibration. In addition, the hermetic package helps
ensure that the end product conforms to its repeatability
and stability specifications long after it leaves the
factory. Highly integrated in a compact form factor, the
low power ADXL357 requires only 200 uA, extending the
life of battery powered applications including wireless
networks for condition monitoring, airborne platforms
such as UAVs or IoT applications.
For More Robust Mounting – ON
Semiconductor’s Python 2000 and 5000
Sensors, Now With LGA Packages
ON Semiconductor has brought out versions with 128-
pin LGA packages for its popular CMOS sensors, the
Python 2000 and Python 5000. This makes the sensors
especially suitable for mounting in applications in rough
surroundings subject to heavy movements. The new
Python variants are available from FRAMOS, the image
processing specialist.
The Python family fromONSemiconductor is particularly
suitable for Machine Vision applications, Intelligent
Traffic Systems (ITS) and inspection applications that
require a high image quality and high speeds using
a state-of-the-art CMOS global shutter. The new
versions of the Python 2000 and 5000 (2 megapixels
and 5 megapixels) are now also available with LGA
packages as connecting and mounting variants. The
LGA packages have very flat contact surfaces on the
underside of the image sensor and, in combination
with flexible bases, exert less mechanical stress on
the PCBs during installation and removal of the sensor
contacts. The LGAs can also be soldered directly in
place for even more stable integration.
FRAMOS sensor expert Sibel Yorulmaz-Cokugur
explains the advantages: “The new 128-pin LGA
packages reduce sensor wear and prevents any
damage. The improved heat dissipation compared to
PIN packages keeps the sensor cooler and produces
less thermal noise. This ensures a longer service life
and lasting image quality, especially when using the
sensors in rough conditions.”
The highly compact and flat LGA packages also require
less space in the PCB design. This allows for more
compact vision systems, greater mounting density,
or more integrated functionality on the PCB itself.
The direct connection on the underside of the sensor
means the LGAs also have a lower impedance and are
therefore less prone to faults as well as providing better
electrical performance.
The industry and product experts at FRAMOS use
their specialist knowledge of sensors and systems
to help customers integrate new sensors into their
applications and projects with additional services such
as development support, customer-specific adaptations
and logistics services. For sensor fitting, FRAMOS
provides advice on the most compatible base, e.g. from
ANDON, and all other components.
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