new products
A maximum junction temperature of 175°C provides for a
larger design margin and relaxed thermal management
requirements.
Availability
GEN2 Series SiC Schottky Diodes are available in available
in either TO-220-2L (packed in tubes in quantities of 1,000) or
TO-252-2L (DPAK) packages (in tape and reel packaging in
quantities of 2,500). Sample requests may be placed through
authorized Littelfuse distributors worldwide. For a listing of
Littelfuse distributors, please visit
Littelfuse.com.Intel Shows 1.59x Performance
Improvement in Upcoming Intel Xeon
Processor Scalable Famil
Intel unveiled significant performance advances in its
upcoming Intel® Xeon® Processor Scalable family. At
the SAP Sapphire NOW conference, Intel showed up to
1.59x1 higher Intel Xeon processor performance running
in-memory SAP HANA workloads over the generation it
replaces, demonstrating what the new products will deliver
to help meet the increasingly complex demands of big-
data, in-memory workloads in the modern data center.
Diane Bryant, group president of the Data Center Group
at Intel, outlined how the Intel Xeon Processor Scalable
family — available in mid-2017 — will provide enhanced
performance to in-memory applications like SAP HANA.
This will provide customers faster time-to-insight and allow
organizations to rapidly respond to change.
Bryant also announced that SAP has certified HANA to
support up to 6x greater2 system memory on the new
Intel platform for 4- or 8-socket configurations over the
representative installed base of systems available four
years ago. More information about the immediate-term
benefits of running SAP HANA workloads on the Intel Xeon
Processor Scalable family is available at Intel’s IT Peer
Network site.
Additionally, exhibiting Intel’s commitment to re-architecting
thedatacenter tosupport the futureneedsof adata-intensive
world driven by the growth of artificial intelligence, 5G,
autonomous driving and virtual reality, Intel demonstrated
live for the first time its future persistent memory solution
in a DIMM form factor. Based on 3D XPoint™ media, Intel
persistent memory is a transformational technology that will
deliver to the mainstream memory that is higher capacity,
affordable and persistent.
With Intel persistent memory, Intel is revolutionizing the
storage hierarchy to bring large amounts of data closer
to the Intel Xeon processor, which will enable many new
usage models and make in-memory applications like SAP
HANA even more powerful. Intel persistent memory will
be available in 2018 as part of an Intel Xeon Processor
Scalable family refresh (codename: Cascade Lake).
During a live demonstration of Intel persistent memory
at SAP Sapphire, Lisa Davis, vice president of IT
Transformation for Enterprise and Government in the data
Data Center Group at Intel, noted that with Intel persistent
memory, in-memory databases like SAP HANA will be
able to deliver even faster transactions, perform real-time
analytics and accelerate business decision-making.
In preparation for next year’s availability, software
developers can accelerate their readiness for Intel
persistent memory today with the libraries and tools at
www.pmem.io. Further product details will be unveiled at
a later date.
1Intel estimate, Intel Xeon processor Scalable family series
as compared to a representative Intel® Xeon® processor
E7 v4 system. Results are based on internal testing and
are provided for informational purposes. Any differences
in your system hardware, software or configuration may
affect your actual performance.
2 SAP certifies SAP HANA 2 platform for OLAP (Online
Analytical Processing) workloads to support up to 3TB
of memory per system for the upcoming Intel® Xeon®
processor Scalable family for a 4 socket configuration (or 6
TB for an 8 socket configuration). Representative systems
available four years ago (Intel® Xeon E7 Processor) were
certified to support up to .5 TB (or up to 1 TB in 8 Socket
configuration), respectively. Up to 6x greater system
memory supported on SAP HANA software vs. available
solutions from 4 years ago (representing Data Center
installed based).
Intel technologies’ features and benefits depend on system
configuration and may require enabled hardware, software
New-Tech Magazine Europe l 75