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Allegro MicroSystems, LLC Announces New

High Current Integrated DC Motor Driver IC

Allegro MicroSystems, LLC announces a new motor driver

IC designed for pulse-width-modulated (PWM) control

of DC motors. Allegro’s A5950 is capable of peak output

currents up to ±3 A and operating voltages up to 40 V. This

new device is targeted at the automotive market with end

applications to include heads-up-display, shift drive, door

closure and engine thermal management applications. It is

also targeted at the commercial market to drive brush DC

motors for ATM cash dispensers, robotic vacuums, printers,

copiers and ticketing and vending applications.

Input terminals are provided for use in controlling the speed,

direction and torque of a DC motor with externally applied

PWM control signals. Internal synchronous rectification

control circuitry is provided to lower power dissipation

during PWM operation and low current standby mode is

included to improve efficiency. Internal circuit protection

includes overcurrent protection, motor lead short to ground

or supply, thermal shutdown with hysteresis, undervoltage

monitoring of VBB, and crossover-current protection.

Diagnostic features include an analog output that can be

used to monitor the current through the external sense

resistor and an open drain FAULTn output.

The A5950 is supplied in a low-profile 4 mm × 4 mm,

16-contact QFN (suffix “EU”) package with wettable flank

option (suffix “-J”), or a 16-lead eTSSOP (suffix “LP”), both

with exposed power tab for enhanced thermal performance.

Allegro MicroSystems, LLC is a leader in developing,

manufacturing

and

marketing

high-performance

semiconductors. Allegro’s innovative solutions serve

high-growth applications within the automotive market,

with additional focus on office automation, industrial,

and consumer/communications solutions. Allegro is

headquartered in Worcester, Massachusetts (USA) with

design, applications, and sales support centers located

worldwide. Further information about Allegro can be found

at

www.allegromicro.com

.

CUI Further Expands Thermal

Management Portfolio with New Line of Heat

Sinks

CUI’s Thermal Management Group today announced

an expansion to its existing portfolio of Peltier devices

and dc fans with the addition of a heat sink product

line. The new line of aluminum heat sinks, available in

both extruded and stamped versions, are compatible

with TO-218, TO-220, TO-252, and TO-263 transistor

packages. Designed to improve the heat dissipation

of low and high power board level applications, these

stampings and extrusions are conveniently measured

under four conditions for thermal resistance, making

it easier to select the optimal heat sink for natural

convection or forced air cooled systems.

The extruded and stamped heat sinks offer tin plated or

black anodized material finishes and are available with or

without solder pins in vertical or horizontal orientations.

Thermal resistances measured at 75°C ΔT in natural

convection environments are as low as 4.49°C/W, while

power dissipation ratings measure up to 16.7 W at 75°C

ΔT in natural convection.

Along with their standard form factors and sizes, CUI

also offers a range of custom heat sink capabilities. With

alternate production methods such as forging and die

casting as well as extrusions and stampings, CUI can

create virtually any shape or profile to fit specific design

needs. A variety of additional materials and finishes

are available, including clear and color anodization,

chromate powder coating, and nickel or zinc plating.

Hole punching for custom mounting patterns is also an

option. In addition, CUI’s standard or custom heat sinks

can be integrated with any of its current Peltier and dc

fan offerings to achieve more complex thermal solutions.

“At CUI, we see the development and expansion of

our thermal management product line as a natural

complement to our industry leading portfolio of power

products,” stated Kraig Kawada, CUI’s VP of Product

Management. “As the heat in applications continues to

rise due to increasing power densities, we believe that

the introduction of these heat sinks, alongwith our current

Peltier devices and dc fans will assist our customers in

meeting their growing thermal management challenges.”

80 l New-Tech Magazine Europe