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EuroWire – May 2011

60

technical article

The three-pass drawing of a mother wire

with a surface crack was repeated in the

experiment and FEM analysis. The obtained

crack deformation behaviour for each

drawing pass is also shown in

Figure 10

.

4.2 FEM analysis of U-shaped crack

deformation behaviour during

repeated drawing

Next, a wire with a U-shaped crack was

modelled and the drawing process was

similarly analysed by finite element

analysis.

Figure 11

shows examples of

crack deformation behaviour for 10mm

diameter wires with a crack of breadth

(a)=0.73mm and depth (h)=0.10mm

(1%) and with a crack of a=0.73mm and

h=0.60mm (6%) during repeated drawing

at α=6° and R/P=20%.

As shown in

Figure 11

, under condition

I, the bottom of the crack rises during

repeated drawing, and thus the surface

crack is removed after the first pass.

Under condition II with the greater depth,

however, the right side of the crack is tilted

so that it overhangs the left side and forms

an overlapping crack (defect), indicating

that the crack cannot be removed by

drawing. Moreover, a deep crack develops

in the wire although it appears to be small.

Namely, the behaviour of the U-shaped

crack during drawing depends on the

depth (h).

The results for the concave and U-shaped

cracks were compared. An overlapping

defect develops from the concave crack,

regardless of the depth (h), whereas for the

U-shaped crack the depth (h) serves as a

parameter; that is, the crack with a shallow

(h) is removed, but the crack remains on

the wire when (h) is greater.

It is considered that the shape of both

sides of the crack significantly affects its

removal under condition I in

Figure 11

.

5 Conclusion

Wire breakage was investigated using

experimentation and finite element

method analysis. A focus was on wire

breakages caused by the presence of a

foreign substance, in or on the wire, or

by transversal cracks that develop on the

surface of wires due to the effect of fatigue,

inclusions or surface flaws.

The obtained results are summarised

below.

1) Surface flaws, foreign materials and

excessive drawing stress generated

by seizing are the causes of wire

breaking. However, many of the causes

of breakage in wires with a diameter of

50μm or less are speculated to be due

to the presence of inclusions that are

formed during casting

2) It is thought that there is a danger of

wire breakage when Di/Do is 0.3 or

higher, and that the highest frequency

of wire breakage is where Di/Do is

approximately 0.7. This was found

to be because drawing stress moves

rapidly upward when an inclusion

passes through the die

3) The result of FEM analysis agrees with

the experimental result; therefore, it is

possible to estimate crack deformation

behaviour by FEM analysis to predict

the state after drawing

4) The

mechanism

underlying

the

removal of a crack in a wire rod is the

rise of the bottom of the crack during

drawing

5) The behaviour of a U-shaped crack

during drawing depends on the depth

(h)

6) Where there is a greater depth,

however, the right side of the crack

is tilted so that it overhangs the left

side and forms an overlapping crack

(defect), indicating that the crack

cannot be removed by drawing.

Moreover, a deep crack develops in the

wire, although it appears to be small

Appearance

Name

Morphology and features

Scab

Foliate mark; rod surface is rubbed bare

Transversal crack Crack perpendicular to rolling direction

Bump

Scale-like cracks on surface

Scratch

Concave crack due to scratching in rolling

direction

Rolled in material Dent resulting from pressing against foreign

substances such as metal chips

Over-filled Defect resulting from continuous indenting in

rolling direction

Figure 7

:

Mesh deformation after repeated drawing of wire with foreign material on the surface examined by FEM

Table 2

:

Classification of surface cracks on wire rod

7

Figure 8

:

Drawing model of wire

Figure 9

:

Work hardening diagram of tested

stainless steel wire

Drawing direction

A) Mother wire

B) 1 pass

C) 2 passes

Transversal

crack

A

0

A

1

is a cross-sectional

area before and after the

processing

Die

Crack

Drawing

direction

Strain

Stress (MPa)