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New-Tech Magazine Europe l 49

processor. Such drivers are specific

for the module and include the

communication protocol as well.

Choices need to be made for the

hardware layer (e.g. I2C, SPI, UART)

and the communication protocol.

The communication protocols used

by some modules are flexible in

terms of output configuration and/

or integration level. For example, the

communication protocol of Fairchild’s

FMT1000 series is implemented for

low-level binary communication, for

C/C++ interfaces and as DLL/.so for

Windows/Linux. Ready-to-run sample

code is available for ARM

®

mbed™.

Test and Calibration

System integrators face several

challenges when mounting MEMS on

a board. For instance, the soldering

process may influence the factory

(statistical) calibration. A module,

in which the inertial sensors are

mounted, doesn’t have these

detrimental effects.

The calibration parameters in discrete

inertial sensors are statistical values.

This means that the variability is

significant. Accelerometer biases of

specifications is often required. Next

is the need for knowledge of MEMS,

sensors and sensor fusion, which is

also time-consuming.

Another challenge in the quickly

changing landscape of MEMS sensors

is that keeping track of changes and

EOL/PCN-notices by vendors also

consumes valuable time.

Dedicated MCU

Retrieving data from the MEMS

sensors is the first step. The next step

is to find an MCU to process this data.

This requires making estimations to

determine the required RAM and

program memory, necessitating

advanced knowledge of the sensor

fusion algorithm, OS, drivers and

signal processing. The type of

processor selected has a significant

impact on system architecture, and

without experience in designing an

IMU and associated signal processing

and sensor fusion, this can be a long

and complex process.

Signal Processing

Signal processing is the next step

in converting the MEMS signals

to a sensible output. For motion

tracking, the user is often interested

in low-bandwidth signals. Yet, a high

bandwidth is required to compensate

for vibrations and coning/sculling

errors. A signal processing pipeline

needs to be optimized for the

anticipated motion. Also, since every

MEMS sensor is different, the signal

processing pipeline should be tailored

to the specific MEMS sensor to make

the best use of its capabilities. An

incorrectly designed signal processing

pipeline will negatively affect the

performance of the module’s output.

OS drivers and communication

To communicate with the module,

there needs to be drivers for

the host, typically an application