April 2016 issue

145 / 190

Components Communication Test&
Measurement
Power
Supply
Electro
Optics&Camera Motion
Packaging &
Production
145 l New-TechMagazine
(<5000 KGD, -DP+ model number
suffix) and full wafers (-DF+ model
number suffix) are also available by
request from authorized Mini-Circuits
sales representatives.
"MCDI" :לפרטים נוספים
077-540-6075 : ט
153-77-540-6051 :פ
Mini-Circuits’ MMIC
Amplifier Die Provides High
IP3 and Flat Gain from 0.01 to
6GHz
Mini-Circuits’ GVA-60-D+ is a
Wideband MMIC amplifier die
fabricated using InGaP HBT
technology supporting a wide range
of applications from 0.01 to 6 GHz.
This model provides high IP3 of
+39 dBm, 20dB gain with ±0.3dB
gain flatness from 50 to 1000MHz,
+20dBm P1dB, and excellent input/
output return loss (14 to 25dB)
without the need for external
matching components. The amplifier
operates on a single +5V supply and
measures only 100x770x700µm,
allowing integration directly into
customer modules where small
size and light weight are critical
requirements.
GVA-60-D+ MMIC amplifier dice may
be ordered from stock in gel-paks
(-DG+ model number suffix) of 10, 50
or 100 KGD. Partial wafers (<5000
KGD, -DP+ model number suffix)
and full wafers (-DF+ model number
suffix) are also available by request
from authorized Mini-Circuits sales
representatives.
"MCDI" :לפרטים נוספים
077-540-6075 : ט
153-77-540-6051 :פ
Mini-Circuits’ MMIC
Splitter/Combiner Die Provides
2 to 26.5GHz Coverage in a
Single Tiny Device
Mini-Circuits’ new EP2K-D+ MMIC
2-way 0˚ splitter/combiner die offers
industry-leading bandwidth, covering
applications from 2 to 26.5 GHz in
a single device. This model is ideal
for wideband systems like defense
and instrumentation which require
full coverage in a single device, and
it delivers consistent performance
across its entire frequency range,
allowing users to reduce part
numbers on their bill of materials with
one model. The splitter/combiner
provides 1.5dB typical insertion loss,
18 dB isolation, 0.1dB amplitude
unbalance and 1.5-8.5˚ phase
unbalance. It handles up to 2.5W
RF input power as a splitter and is
capable of passing up to 1.2A DC
current from input to output. The die
measures only 200x2650x1880µm,
allowing integration directly into
customer modules where small
size and light weight are critical
requirements.
EP2K-D+ MMIC splitter/combiner
dice may be ordered from stock in
gel-paks (-DG+ model number suffix)
of 10, 50 or 100 KGD. Partial wafers
(<5000 KGD, -DP+ model number
suffix) and full wafers (-DF+ model
number suffix) are also available by
request from authorized Mini-Circuits
sales representatives.
"MCDI" :לפרטים נוספים
077-540-6075 :ט
153-77-540-6051 :פ
Mini-Circuits’ Tiny LTCC
90° Hybrid, 800 to 1250MHz
Mini-Circuits’ QCN-12A+ is an ultra-
small ceramic surface-mount 90°
hybrid supporting applications from
800 to 1250 MHz including cellular,
GSM and more. This model provides
0.4 dB insertion loss, 17 dB isolation,
2.5° phase unbalance and 0.5dB
amplitude unbalance. It is capable
of handling RF input power up to
15W and comes housed in a 1206
LTCC package with wraparound
terminations for excellent
solderability. It’s the perfect
building block for buffering circuits
from reflective elements, push-pull
amplifiers, and other cases where
90° phase offset is needed.
"MCDI" :לפרטים נוספים
077-540-6075 : ט
153-77-540-6051 : פ