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new products
72 l New-Tech Magazine
Global Product Manager for High
Reliability Connectors: “As electronics
becomes
pervasive
in
harsh
environments where high levels of
shock and vibration are experienced,
customers are demanding fixing
solutions that provide the highest
confidence levels. Autosport teams, for
example, that used to use plastic latches
are now moving over to jackscrews for
added security. Robotics is another
example where repeated mating can
lead to the latch wearing, so jackscrews
are now commonly preferred.”
Harsh conditions
Satellites,
especially
miniature
CubeSats, are relying on jackscrews
not only to ensure that the connection
survives harsh operation conditions,
but also to save space. Flower: “One
Datamate customer is using the
jackscews to connect four boards in a
box section. The boards then become
self-supporting and the use of space –
always a concern in satellite design – is
maximised.”
Harwin recommends that users torque
Datamate jackscrews to 21 +/- 2 cN/m.
This ensures that devices meet EIA
specifications for vibration severity.
Jackscrews are available with all
Harwin’s Datamate and Mix-Tek (mixed
signal, power and coax) connectors.
Find more information on Datamate and
the Datamate J-Tek range, or download
the Datamate Jackscrew guide
ON Semiconductor
Expands Optical Image
Stabilization Portfolio,
Bringing Superior Picture
Quality to Built-In Camera
Applications
ON
Semiconductor
(Nasdaq:
ON ),driving energy efficiency
innovations,
introduces
its
next generation Optical Image
Stabilization (OIS) / Auto Focus
(AF) driver, LC898123AXD,to its
portfolio, offering a premier digital
still camera and video experience
for
smart
phones,
tablets,
notebooks, and wearables, by using
advanced auto-focus, and optical
image stabilization technologies
to overcome the performance
limitations of traditional camera
modules.
The LC898123AXD OIS / AF driver
integrates a DSP core with multiple
analog peripherals for image
stabilization, auto-focus control,
and H-bridge and constant-current
drivers. The addition of on-chip
Flash memory provides storage for
the DSP program and calibration
parameters, thus saving 90% of the
overhead time needed to load from
conventional memory on startup.
This highly integrated solution
enables faster implementation
of OIS and AF functionality into
camera modules while remaining
compatible with a wide array of
image sensors. Furthermore, the
high level of functional integration
supports the need for very thin
camera modules.
“There is growing demand for
enhanced image clarity and
quality in the latest smartphone
models, as on-the-go consumers
expect to derive better and better
user
experiences
regardless
of device size,” said Tomofumi
Watanabe, Business Unit Leader
of the Power Solutions Products in
Intelligent Power Solution Division
at ON Semiconductor. “The
LC898123AXD enables camera
module designers to meet these
ever demanding requirements”.
The LC898123 has best-in-class
current consumption, enabling
improved battery lifetime. The DSP
performance and flexibility allows
support for various VCM actuators.
The
high-performance
32-bit
DSP optimized for OIS/AF signal
processing covers many functions,
such as servo control, gyro data
filtering, and host command
interface. In addition, the LC898123
offers “High Level Command”
function to standardize commands
from the main CPU to the camera
module, enabling phone developers
to use standardized commands for
multiple camera modules/actuators
without changing CPU software.
Reference designs dedicated to
Camera Module Integrators are
available, accelerating the OIS/AF
evaluation as well as reduce the
development workload.
Packaging and Pricing
The LC898123AXD is offered in a
Pb-free WLCSP-35 package and
is priced at $ 2.18 per unit in 4,000
unit quantities.
Infineon and GoerTek