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new products
New-Tech Magazine l 75
(lightweight IP) open-source TCP/
IP stack.
The
STM32F7
ecosystem
enables developers to create
microcontroller applications with
sophisticated user interfaces that
formerly required the resources of
a Microprocessor Unit (MPU). The
MCU devices, which are based
on the 216MHz/462DMIPS/1082
CoreMark®ARM®Cortex®-M7 core
with double-precision floating-point
unit and DSP instructions, combine
enhanced graphics capabilities with
extensive connectivity through:
ST’s Chrom-ART Accelerator™ and
a hardware JPEG accelerator for
high-speed graphics rendering;
Support for TouchGFX, which
allows high-performance graphics
and touch at minimal CPU loading;
Support for Embedded Wizard,
which allows high-performance
graphics and comes with a PC-
based utility that helps build GUIs
using graphical tools and drag &
drop actions;
STemWin professional graphics
library and development tools;
Support for USB2.0 with OTG;
CAN2.0 port and Ethernet with
IEEE 1588 time-stamping ideal for
industrial applications;
HDMI
Consumer-Electronics
Control (CEC), a camera interface,
and dual-mode Quad-SPI interface
to high-speed off-chip memory;
Multiple 16- and 32-bit timers and
12-bit 2MSPS ADCs;
Audio features including 12-bit
DACs, I2S (Inter-IC Sound) serial
interface with Phase-Locked Loop
(PLL) support, digital filters for a
sigma-delta modulator, and an S/
PDIF receiver.
The
STM32F769I-EVAL
and
STM32F779I-EVAL
evaluation
boards are priced at $360, while the
$79 Discovery Kit (STM32F769I-
DISCO) and the $23 STM32
Nucleo-144 board (NUCLEO-
F767ZI) enable extremely low-
cost design starts. All are available
immediately, and can be ordered
directly from ST or distributors.
Cadence Expands OrCAD
Solution to Address Flex and
Rigid-Flex Design Challenges
for IoT, Wearables and Mobile
Devices
at CDNLive EMEA, Cadence
Design Systems, Inc. (NASDAQ:
CDNS) announced the OrCAD 17.2-
2016 release with new capabilities
for OrCAD® Capture, PSpice®
Designer and PCB Designer that
address challenges with flex and
rigid-flex design as well as mixed-
signal simulation complexities
in IoT, wearables and wireless
mobile devices.This latest release
reduces PCB development time
by addressing the need to design
reliable circuits for smaller, more
compact devices.
This OrCAD portfolio includes
technology enabled for integrated
rigid-flex planning, design and real-
time visualization, as well as built-in
translators that enable direct design
imports from select EDA vendors.
PSpice Designer now supports
system-level simulation using C/
C++/SystemC and VerilogA, via
the new PSpice compact model
interface. This enables hardware/
software virtual prototyping so that
electrical engineers can design and
simulate intelligent IoT devices.
OrCAD is the only fully scalable
PCB design solution available in the
market that seamlessly transitions
from mainstream to enterprise
PCB solution with the Allegro®
environment. For more information
on the latest OrCAD solution, visit:
www.orcad.com/orcad-172-2016-release.
To enable a faster and more
efficient flex and rigid-flex design
creation critical to IoT, wearables
and wireless devices, the OrCAD
portfolio uses a new multi-stack-up
database capability and extensive
in-design inter-layer checks, which
helps users avoid errors introduced
through manual checking. The
OrCAD portfolio also features
enhancements targeted towards
improving PCB editors’ productivity
and ease-of-use in padstack
editing, constraint management,
shape editing and in-design DRCs.
To address efficiency needs, the
portfolio includes an advanced
design differencing engine that
enables design review with global
teams using state of art visuals.
Finally, to give designers more
control over their design component
annotation process, advanced
annotation and auto-referencing
capabilities are now available.
“This latest OrCAD release has
given us confidence in getting
a functional PCB without CAD