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new products
sensors, announced the Mini-IO connector has been
adopted as an international standard (IEC 61076-3-122)
by the International Electrotechnical Commission (IEC).
IEC 61076-3-122 provides the minimum requirements
for a miniaturized connector for industrial applications
and thus ensures safety through consistent performance
and interoperability. Connector requirements for
industrial applications are high as they typically run in
harsh environments with high mechanical demands
from vibrations and rapid movements, environmental
stress through dust and humidity, and possible
exposure to radiated electromagnetic fields.
“TE is pleased that with the completion and publication
of IEC 61076-3-122, the Mini-IO is the first standardized
miniaturized industrial communication connector for
an IP20 environment. Beyond its advantages for
industrial applications in harsh environments, the small
dimensions of the connector enable smaller devices
and therefore higher packing densities inside cabinets,”
said Guenter Feldmeier, global standardization &
consortia leader of TE’s Industrial business unit. “TE
Connectivity is pleased that the mini- i/O Standard was
based on our technology.”
Referring to its current use in industrial automation
systems such as MECHATROLINK and VARAN,
Feldmeier adds: “The reliability of the Mini-IO in harsh
environments is already demonstrated by industry
users. The standard now offers an exciting opportunity
to accelerate the adoption by further eco-systems.”
Metal Backshells with Built-In Shielding
Ensure Ongoing Electrical & Mechanical Integrity
To complement its widely-used Datamate wire-to-
board connector offering, Harwin now supplies a
comprehensive range of backshells with a rugged
aluminium alloy construction and electroless nickel
plating. Through these accessories, which can be
applied to new installations or alternatively for carrying
out mid production modifications, engineers are able
to add increased levels of mechanical robustness, as
well as providing the necessary EMI/RFI protection.
As a result, prolonged operational lifespans can be
benefitted from even in the most uncompromising of
application conditions.
Incorporated into the female cable versions is a highly
convenient attachment feature viawhichbraid screening
can be achieved with maximum effectiveness. There is
a large elliptical entry hole for braid placement, along
with a choice of slotted or hexagonal jackscrews on
either side for securing the connection (as well as
providing strain relief). The male backshell is designed
for panel mount applications, and is compatible with
both cable or vertical PCB connector styles. Full 360
degree EMI/RFI shielding is delivered once the male/
female mating process has been completed. A working
temperature range spanning from -55°C to +125°C is
supported.
The new Harwin backshells can be used in conjunction
with both the company’s J-Tek and its Mix-Tek
Datamate connector product lines – with signal,
power and coax cabling all being accommodated.
The combined Datamate/backshell assemblies are
significantly lower in overall cost than equivalent
Micro-D/backshell arrangements. Made to order,
only low minimum volumes are required and there
are very short turnaround times involved. Among the
key areas where these items will be employed are
aerospace, motorsport, industrial drives/controls,
military communication, satellite systems, robotics and
renewable energy infrastructure.
OMC launches new small-footprint SMA
Tx/Rx housings
OMC, the pioneer in optoelectronics manufacturing,
New-Tech Magazine Europe l 73