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new products
NXP Introduces Industry’s First Automotive-
Qualified Bluetooth 5-Ready Wireless
Microcontrollers with integrated CAN-FD
NXP Semiconductors N.V. (NASDAQ: NXPI) today
announced its Kinetis KW35/36 MCU family, the
industry’s first automotive-qualified Bluetooth 5-ready
wireless MCU family with integrated CAN-FD
connectivity. Its AEC Q100-Grade 2 temperature range
qualification paired with the latest Bluetooth technology
enables this new MCU family to offer superior durability
and performance in automotive applications.
The Kinetis KW35/36 Bluetooth technology is designed
to simplify integration of Bluetooth connectivity in cars,
enabling automotive manufacturers to deliver added
convenience for consumers to control many features
using their smartphones, for example unlocking a
car, remotely sharing keys with a friend or relative,
personalizing seat positions as well as temperature
and infotainment settings and controlling interior and/
or exterior lighting. As a market leader in automotive
and security solutions, the new Kinetis KW35/36
wireless MCU family complements the company’s
automotive secure access portfolio as it can be used
to add a smartphone car access option next to the
current passive entry and start system. Emerging BLE
smartphone car access systems typically come with
an NFC backup option to cover low battery situations.
The MCU’s Bluetooth connectivity can also be used
to communicate car diagnostics such as tire pressure
monitoring systems (TPMS) as well as battery and fuel
levels.
“With our deep customer intimacy and leadership in
automotive, the Kinetis KW35/36 wireless MCU family
represents our commitment to deliver innovative
solutions that drive better experiences for drivers around
the world. This family is the industry’s first automotive-
qualified BLE family of MCUs with CAN-FD allowing for
easy integration into an auto in-vehicle communication
network,” said Emmanuel Sambuis, Vice President of
Microcontrollers and Connectivity at NXP. “Our goal
has always been to provide more secure, connected
experiences for drivers. Combining our connectivity
technology with automotive grade expectations opens
up new opportunities for car manufacturers and drivers.”
Kinetis KW35/36 MCU Family Features:
Eight concurrent secure connections for multiple
authorized users.
Hardware and software features for smartphone-to-
car connectivity.
Low power consumption to extend battery life
Bluetooth 5 certified software stack
CAN and LIN drivers to enable easy integration into
auto in-vehicle communication networks
6 mm x 6 mm QFN package with wettable flanks
package technology to facilitate optical inspection of
the soldering, reducing cost and increasing reliability
MCUXpresso software and tools for ease of
development
FRDM-KW36 development board for Kinetis
KW35/36 MCUs with 2.4 GHz BLE and generic FSK
wireless connectivity and CAN/LIN wired connectivity
solutions
USB-KW41Z USB dongle for sniffer operations
Availability
The new Kinetis KW35/KW36 MCU family is sampling
now and will be available in volume production in Q2
2018.
Intel Enables 5G, NFV and Data Centers
with High-Performance, High-Density ARM-
based Intel Stratix 10 FPGA
MAX14883E delivers ±60V fault protection, selectable
Intel today announced it has begun shipping its Intel
®
Stratix
®
10 SX FPGA – the only high-end FPGA family
with an integrated quad-core ARM* Cortex*-A53
processor. With densities greater than 1 million logic
elements (MLE), Intel Stratix 10 SX FPGAs provide
the flexibility and low latency benefit of integrating an
ARM processor with a high-performance, high-density
FPGA needed to tackle the design challenges of next-
generation, high-performance systems.
By integrating the FPGA and the ARM processor,
Intel Stratix 10 SX FPGAs provide an ideal solution
for 5G wireless communication, software defined
68 l New-Tech Magazine Europe