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new products
radios, secure computing for military applications,
network function virtualization (NFV) and data center
acceleration.
For NFV applications that consolidate and deliver the
networking components needed to support a fully
virtualized infrastructure, Intel Stratix 10 SX FPGAs
can handle the high-speed data path while integrated
processors enable the low latency transactions needed
to manage flow tables for control plane processing.
With hardware acceleration, Intel Stratix 10 SX FPGAs
provide a heterogeneous computing environment to
create optimized, low latency accelerators. In secure
computing applications, integrated processors make
it much more difficult to snoop software operations
thereby helping keep data secure. These devices also
enable general purpose utility processing to extend
convenience and form factor reduction in high-end
systems.
“With Intel Stratix 10 SX FPGAs, Intel reaffirms its
‘all in’ commitment to SoC FPGA devices combining
integrated, flexible ARM cores with high-performance
FPGAs,” said Reynette Au, vice president of marketing,
Intel Programmable Solutions Group. “We now provide
a wide set of options for customers needing processors
and FPGAs, with device offerings across the low-end,
mid-range and now, high-end FPGA families, to enable
their system designs.”
Customers can implement their designs today with the
Intel Stratix
®
10 SX FPGA, using the Intel SoC FPGA
Embedded Development Suite (Intel
®
SoC FPGAEDS),
a comprehensive tool suite for embedded software
development. It comprises development tools, utility
programs, and design examples to jump-start firmware
and application software development.
The Intel
®
SoC FPGA EDS also enables customers to
utilize the ARM* Development Studio 5* (DS-5*) Intel
SoC FPGA Edition to code, build, debug and optimize
their applications.
Manufactured on the Intel 14-nanometer process
technology, the Intel Stratix
®
10 SX FPGA combines an
ARM hard processor system with the Intel HyperFlex™
core fabric architecture to create a high-performance
and power-efficient SoC FPGA.
Intel, the Intel logo, Stratix, and Intel HyperFlex are
trademarks of Intel Corporation or its subsidiaries in the
U.S. and/or other countries.
ON Semiconductor Introduces World’s
First Highly Scalable Family of Next-
Generation Automotive Image Sensors
ON Semiconductor, driving energy efficient innovations
and the market leader in automotive imaging, today
announced a CMOS image sensor platform that
brings new levels of performance and image quality
to automotive applications such as ADAS, mirror
replacement, rear and surround view systems and
autonomous driving. The Hayabusa™platform features
a ground-breaking 3.0-micron backside illuminated
pixel design that delivers a charge capacity of 100,000
electrons, the highest in the industry, with other key
automotive features such as simultaneous on-chip
high dynamic range (HDR) with LED flicker mitigation
(LFM), plus real-time functional safety and automotive
grade qualification.
“The Hayabusa family enables automakers to meet
the evolving standards for ADAS such as European
NCAP 2020, and offer next-generation features such
as electronic mirrors and high-resolution surround
view systems with anti-flicker technology. The scalable
approach of the sensors from ½” to ¼” optical sizes
reduces customer development time and effort for
multiple car platforms, giving them a time-to-market
advantage.” said Ross Jatou, VP and GM of the
Automotive Solutions Division at ON Semiconductor.
“ON Semiconductor has been shipping image sensors
with this pixel architecture in high-end digital cameras
for cinematography and television. We are now putting
this proven architecture into new sensors developed
from the ground up for automotive standards.”
The high charge capacity of this pixel design enables
every device in the Hayabusa family to deliver Super-
Exposure capability, which results in 120-decibel (dB)
HDR images with LFM for high image fidelity in the
most challenging scenes without sacrificing low-light
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