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new products
protection against cyber-attacks,” saidAntonio Radaelli,
Infotainment Business Unit Director, Automotive and
Discrete Product Group, STMicroelectronics. “Our
new Telemaco3P processors combine ST’s proven
expertise in hardware security and knowledge of the
automotive industry’s standards and requirements
to lay solid ground for safe and enjoyable connected
motoring.”
The new automotive processors are part of a
comprehensive ST strategy to offer products with
embedded security functions that include stand-
alone Secure Elements (ST33) and embedded Flash
microcontrollers (SPC5).
ST is providing engineering samples of the STA1385
to lead partners now and full production is scheduled
for mid-2018.
Cypress Enables Dynamic 3D Graphics
in Hybrid Instrument Clusters and Head-Up
Displays with New Automotive MCU Solution
Cypress Enables Dynamic 3D Graphics in Hybrid
Instrument Clusters and Head-Up Displays with New
Automotive MCU Solution
Cypress Semiconductor Corp. today announced a
new series in its Traveo™ automotive microcontroller
(MCU) family with more memory to support a hybrid
instrument cluster with 3D graphics and up to 6
traditional gauges, as well as a head-up display. The
highly integrated, single-chip devices in the S6J32xEK
series include an advanced 3D and 2.5D graphics
engine and provide scalability with Cypress’ low-
pin-count HyperBus™ memory interface. The series
continues Cypress’ expansion of its broad automotive
portfolio with differentiated system performance via
its MCUs, wireless radios, capacitive-touch solutions,
memories and Power Management ICs (PMICs).
“Our automotive customers are looking to integrate
increasingly more dynamic 3D graphics in their hybrid
instrument cluster and head-up displays to appeal to
consumers,” said Mathias Braeuer, product marketing
director of the Automotive Business Unit at Cypress.
“Cypress developed our new Traveo MCU series
specifically to provide a scalable, cost-effective, single-
chip solution to address these applications, and we
are pleased to having some of the world’s leading
automotive suppliers designing in this solution.”
The Traveo S6J32xEK series integrates up to 4MB of
high-density embedded flash, 512 KB RAM and 2MB
of Video RAM, an Arm
®
Cortex
®
-R5 core at 240-MHz
performance, a Low-Voltage Differential Signaling
(LVDS) video output, a Low-Voltage Transistor-
Transistor Logic (LVTTL) video output and a 6x stepper
motor control. This combination enables the devices
to serve as single-chip solutions to drive two displays.
The devices have up to two 12-pin HyperBus memory
interfaces that dramatically improve read and write
performance of graphical data and other data or code.
A single HyperBus interface can be used to connect
to two memories for Firmware Over-The-Air (FOTA)
updates, which enable end-users to get software fixes
and new features and applications for their vehicles on-
the-go. The devices support all in-vehicle networking
standards required for instrument clusters, including
Controller Area Network-Flexible Data (CAN-FD) and
Ethernet AVB. Additionally, the series provides robust
security with integrated enhanced secure hardware
extension (eSHE) support.
The Traveo S6J32xEK series include 50 channels of
12-bit Analog to Digital Converters (ADC), 12 channels
of multi-function serial interfaces and I2S interfaces
with an AUDIO DAC to output the complex, high-quality
sounds required in today’s instrument clusters. The
devices’ support for Ethernet AVB delivers increased
bandwidth in multimedia applications and reduced
programming time. The S6J32xEK series offers
functional safety features to support Automotive Safety
Integrity Level (ASIL) B, and the devices feature a wide
ambient temperature range of -40˚C to +105˚C. The
Traveo family is backed by a comprehensive tools and
software ecosystem that simplifies system integration,
including AUTOSAR MCAL 4.0.3 support.
Availability
The Traveo S6J32xEK series is sampling now and
will be in production in the first quarter of 2018. The
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