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63

www.read-wca.com

Wire & Cable ASIA – January/February 2014

Plasmait GmbH

Philipsstraße 27 / C3, 8403

Lebring

Austria

Tel

: +43 3182 52 4751

Email

:

info@plasmait.com

Website

:

www.plasmait.com

The inter-metallic bond can be achieved only if the wire

surface is clean and appropriately activated. Acid cleaning

or pickling has traditionally been used to clean the wire

surface prior to surface activation, which is achieved

with fluxing. Fluxing is a dirty and environmentally

compromising process that can also be harmful to the

operators.

Figure 4

compares the process steps of the traditional hot

dip tinning to the process steps of the PlasmaPREPLATE

tinning.

PlasmaPREPLATE process anneals, cleans and activates

the surface of copper ribbon before it enters the tin bath

to allow tin adhesion without the need for fluxing. Flux-free

tinning accelerates the creation of intermetallic layer, which

in turn results in a considerably higher tinning speed when

compared to the tinning speed of the traditional process.

PlasmaPREPLATE process can be tuned to anneal the

copper ribbon to any required softness.

Complete recrystallisation with yield strengths down to

50MPa and small grain size can be achieved. Performing

annealing in-line with tinning reduces the amount of soft

material manipulation.

Less stress and mechanical deformation reduces the

potential for yield strength and camber build up on the

rolling line takeup and tinning line payoff. It is important

to recognise the need for precision handling and accurate

winding in case of super soft ribbon.

Precision transport system for handling of super soft

ribbon can be an expensive investment, which is required

on every tinning line. Faster tinning lines can therefore

reduce the capital investment in transport systems per unit

of production output.

The traditional tinning lines require acid cleaning,

rinsing and fluxing prior to tinning. These wet processes

are not only environmentally questionable, they are

also hazardous and unpleasant for the operator. Flux

contamination of tin bath leads to high cost of solder

waste. The use of wet processes adds to the number of

production parameters that must be closely controlled.

Production of expensive, precision products with tight

tolerances such as interconnect ribbon requires tight

control of the production conditions to avoid excessive

scrap rates. This is often difficult to achieve when wet

processes are involved. The differences between the two

processes can be divided into the differences related

to production efficiency and the differences in finished

product quality.

Despite higher capital investment, PlasmaPREPLATE

tinning process offers a number of benefits that translate

into considerable long-term savings:

• Production speed of up to 150m/min compared to 5m/

min-60m/min in a traditional process means fewer

tinning lines, smaller machinery footprint and less

manpower

• Process stability, increased production uptime and

less frequent spool changeovers means less material

manipulation and less operator involvement in

PlasmaPREPLATE tinning line

• Dry surface preparation with plasma replaces acid

cleaning, rinsing, drying, fluxing, waste disposal, and

water treatment used in the traditional process

• Less tin waste due to flux-free production

• Quick changeover between different products and

specifications

• Lower cost of production in terms of power, manpower,

cost of chemicals and their manipulation as well as

maintenance

• In-line quality control in the PlasmaPREPLATE tinning

process translates into consistent product quality, less

scrap and fewer returns

The key production parameters in the traditional

tinning are compared to the production parameters of

PlasmaPREPLATE tinning in

Table 1.

In addition to production efficiency plasma process offers

a number of product quality advantages when compared

to the traditional tinning process:

• Superior and consistent product quality is reflected in:

• Super soft wire with yield strength down to 60 MPa on

spool and elongation over 30%

• Smooth consistent and shiny coating with tighter

thickness tolerance

• Dry, flux-free and chemical-free tinning simplifies

process control, which translates into more consistent

product quality

• In-line laser coating thickness measurement system

can be justified on a high-speed plasma line

• Computer enabled, in-line product quality control with

alarm and surface fault database simplifies quality

control activities

• Computer assisted Production Recipe Database

is an essential tool for the operator and product

manager and an integral part of production know-how

management

It is the stability of PlasmaPREPLATE process, consistency

of product quality, low cost of operation as well as low

scrap rates and tin waste that have won the confidence

of many PV ribbon manufacturers since 2007 when

PlasmaPREPLATE tinning process was first introduced to

PV ribbon production.